Increase heat spreading and not thermal resistance.
Traditionally, engineers have to choose aluminum or copper for thermal management devices such as heatsinks and coldplates. The problem is that although copper may be required for certain cooling solutions to work, copper is heavy and expensive. To utilize aluminum with copper, complex systems of thermal interface materials in conjunction with mechanical attachment is the only viable option. These methods increase thermal resistances and create galvanic corrosion issues.
Clad materials from Spur provide the best of both worlds, the heat spreading of copper with the lighweight and low cost of aluminum. Best of all, the clad is based upon atomic level electron sharing and the bond provides no thermal resistance over the base materials. Spur's patent pending partial clad technology also allows aluminum or copper to be placed just where it needs to be.
- Vapor Chambers
- Liquid cooling coldplates
Spur specializes in copper to aluminum bonded metals. 110(ETP) copper is the standard for spreading, but we also can use 101 and 102 oxygen free high conductivity (OHFC) for your demanding applications. Pure aluminum 1050 is optimal for heat transfer, and 6061 and 6063 is avaiable for parts that require machining.
Aluminum fins joined to copper spreader with no thermal resistance
Eliminate galvanic corrosion with aluminum bonded to copper